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An Analysis of Void Deformation Caused by Power Law Creep and Diffusion Enhanced by Mechanical stress in HIP Process
- Title
- An Analysis of Void Deformation Caused by Power Law Creep and Diffusion Enhanced by Mechanical stress in HIP Process
- Authors
- 김기태
- Date Issued
- 1990-10-01
- Article Type
- Conference
- Citation
- 27th Society of Engineering Science Conference, 1990-10-01
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Related Researcher
- 김기태KIM, KI TAE
- Dept of Mechanical Enginrg