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An Analysis of Void Deformation Caused by Power Law Creep and Diffusion Enhanced by Mechanical stress in HIP Process

Title
An Analysis of Void Deformation Caused by Power Law Creep and Diffusion Enhanced by Mechanical stress in HIP Process
Authors
김기태
POSTECH Authors
김기태
Date Issued
1-Oct-1990
URI
http://oasis.postech.ac.kr/handle/2014.oak/90862
Article Type
Conference
Citation
27th Society of Engineering Science Conference, 1990-10-01
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김기태KIM, KI TAE
Dept of Mechanical Enginrg
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