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dc.contributor.author김기태-
dc.date.accessioned2018-06-24T12:44:31Z-
dc.date.available2018-06-24T12:44:31Z-
dc.date.created2009-03-27-
dc.date.issued1990-10-01-
dc.identifier.urihttps://oasis.postech.ac.kr/handle/2014.oak/90862-
dc.relation.isPartOf27th Society of Engineering Science Conference-
dc.relation.isPartOf27th Society of Engineering Science Conference, Oct. 21-25, 1990, Santa Fe, New Mexico-
dc.titleAn Analysis of Void Deformation Caused by Power Law Creep and Diffusion Enhanced by Mechanical stress in HIP Process-
dc.typeConference-
dc.type.rimsCONF-
dc.identifier.bibliographicCitation27th Society of Engineering Science Conference-
dc.citation.title27th Society of Engineering Science Conference-
dc.contributor.affiliatedAuthor김기태-
dc.description.journalClass1-
dc.description.journalClass1-

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김기태KIM, KI TAE
Dept of Mechanical Enginrg
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