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Superhydrophobic nano-wire entanglement structures SCIE SCOPUS

Title
Superhydrophobic nano-wire entanglement structures
Authors
Kim, DHwang, WPark, HCLee, KH
Date Issued
2006-12
Publisher
IOP PUBLISHING LTD
Abstract
Superhydrophobic nano-wire entanglement structures (NWES) were fabricated by the dipping method, based on an anodization process in oxalic acid. The pore diameter and the depth were influenced by the applied voltage and the anodizing time. To obtain the NWES, polytetrafluoroethylene (PTFT, Teflon (R): DuPont (TM)) replication based on the dipping method was used, with a PTFT solution (0.3 wt%). During replication, the polymer sticking phenomenon due to van der Waals interactions creates microscale bunch structures on the nanoscale wire-entanglement structures. This process provides a hierarchical structure with nanostructures on microstructures and enables commercialization. The diameter of the replicated wires was about 40 nm, and their lengths were 22-75 mu m according to the anodizing time. The fabricated surface has superhydrophobicity; the apparent contact angle of the PTFT micro and nanostructures is about 160 degrees-170 degrees and the sliding angle is less than 1 degrees.
Keywords
ANODIC ALUMINUM-OXIDE; HEXAGONAL PORE ARRAYS; POLYELECTROLYTE MULTILAYERS; POROUS ALUMINA; CONTACT-ANGLE; SURFACES; FILM; FABRICATION; TEMPLATE; WETTABILITY
URI
https://oasis.postech.ac.kr/handle/2014.oak/23694
DOI
10.1088/0960-1317/16/12/011
ISSN
0960-1317
Article Type
Article
Citation
JOURNAL OF MICROMECHANICS AND MICROENGINEERING, vol. 16, no. 12, page. 2593 - 2597, 2006-12
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박현철PARK, HYUN CHUL
엔지니어링 대학원
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