Microchamber/nanodimple polystyrene surfaces constructing cell aggregates fabricated by thermoset mold-based hot embossing
SCIE
SCOPUS
- Title
- Microchamber/nanodimple polystyrene surfaces constructing cell aggregates fabricated by thermoset mold-based hot embossing
- Authors
- Min Jin Choi; Kyoung Je Cha; Kim, HW; Moon-Hee Na; Bong-Kee Lee; Hwang, W; Kim, DS
- Date Issued
- 2013-10
- Publisher
- ELSEVIER SCIENCE BV
- Abstract
- In this study, a thermoset mold-based hot embossing technique was evaluated for the laboratory-scale replication of thermoplastic surfaces with microchamber/nanodimple (MCND) structures, which enable to construct cell aggregates. Two different types of MCND polystyrene (PS) surfaces of an indented microlens/nanodimple PS surface and an indented micropyramid/nanodimple PS one were replicated by the present hot embossing technique as a proof-of-concept study. In the hot embossing process, two different polyurethane (PU) molds were fabricated from microindented nanodimple-anodic aluminum oxide templates through the UV molding process instead of manufacturing a metal mold. In order to optimize the processing condition of the PU mold-based hot embossing process, a parametric study was carried out based on the Taguchi method. Finally, the PS MCND surfaces replicated under the optimized hot embossing condition were applied to platforms for constructing cell aggregates. (C) 2013 Elsevier B.V. All rights reserved.
- Keywords
- Polyurethane mold; Hot embossing; Taguchi method; Polystyrene; Cell aggregates; Microchamber/nanodimple (MCND); Microindented nanodimple-anodic aluminum oxide (MNAAO)
- URI
- https://oasis.postech.ac.kr/handle/2014.oak/14538
- DOI
- 10.1016/J.MEE.2013.02.049
- ISSN
- 0167-9317
- Article Type
- Article
- Citation
- Microelectronic Engineering, vol. 110, page. 340 - 345, 2013-10
- Files in This Item:
- There are no files associated with this item.
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.