Influence of reduction ratio on the interface microstructure and mechanical properties of roll-bonded Al/Cu sheets
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SCOPUS
- Title
- Influence of reduction ratio on the interface microstructure and mechanical properties of roll-bonded Al/Cu sheets
- Authors
- Lee, KS; Lee, SE; Sung, HK; Lee, DH; Kim, JS; Chang, YW; Lee, S; Kwon, YN
- Date Issued
- 2013-10-20
- Publisher
- ELSEVIER SCIENCE SA
- Abstract
- Two-ply Al/Cu sheets were prepared via roll bonding with different reduction ratios. Al/Cu sheets fabricated below 50% of reduction ratio exhibited relatively equiaxed grains without interface reaction, which resulted in weak joint-bonding strength. However, both strong metallurgical bonding at interface and fine, elongated grains from constituent alloys adjacent to the interface were successfully introduced under the reduction ratio of 65%, leading to a strongly enhanced bonding strength of 17.1 N/mm together with an increased elongation up to fracture by 28%. (c) 2013 Elsevier B.V. All rights reserved.
- URI
- https://oasis.postech.ac.kr/handle/2014.oak/92418
- DOI
- 10.1016/J.MSEA.2013.06.077
- ISSN
- 0921-5093
- Article Type
- Article
- Citation
- MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, vol. 583, page. 177 - 181, 2013-10-20
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