Effect of physical and mechanical properties of epoxy resins on adhesion behavior of epoxy/copper leadframe joints
- Title
- Effect of physical and mechanical properties of epoxy resins on adhesion behavior of epoxy/copper leadframe joints
- Authors
- 조길원
- Date Issued
- 2000-01-01
- URI
- https://oasis.postech.ac.kr/handle/2014.oak/81261
- Article Type
- Conference
- Citation
- 한국고분자학회 연구논문, page. 178, 2000-01-01
- Files in This Item:
- There are no files associated with this item.
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.