The Effect of Microstructure and Temperature on the Load Relaxation Behavior of Microduplex
- Title
- The Effect of Microstructure and Temperature on the Load Relaxation Behavior of Microduplex
- Authors
- 장영원
- Date Issued
- 1999-11-01
- Publisher
- Mech. Behav. of Mater.
- URI
- https://oasis.postech.ac.kr/handle/2014.oak/79441
- Article Type
- Conference
- Citation
- Proc. 12th Conf. on Mech. Behavior of Mater., 1999-11-01
- Files in This Item:
- There are no files associated with this item.
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.