Application of Microelectronics by Using Powder Injection Molding
- Title
- Application of Microelectronics by Using Powder Injection Molding
- Authors
- 박성진
- Date Issued
- 2013-09-11
- Publisher
- Korea Printed Electronics Association
- URI
- https://oasis.postech.ac.kr/handle/2014.oak/64590
- Article Type
- Conference
- Citation
- ICFPE 2013, 2013-09-11
- Files in This Item:
- There are no files associated with this item.
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