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Application of Microelectronics by Using Powder Injection Molding

Title
Application of Microelectronics by Using Powder Injection Molding
Authors
박성진
POSTECH Authors
박성진
Date Issued
11-Sep-2013
Publisher
Korea Printed Electronics Association
URI
http://oasis.postech.ac.kr/handle/2014.oak/64590
Article Type
Conference
Citation
ICFPE 2013, 2013-09-11
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박성진PARK, SEONG JIN
Dept of Mechanical Enginrg
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