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Thin film encapsulation for flexible electronics using silicon nitride deposited by PECVD
- Title
- Thin film encapsulation for flexible electronics using silicon nitride deposited by PECVD
- Date Issued
- 2012-04-12
- Publisher
- 한국고분자학회
- Article Type
- Conference
- Citation
- 2012 춘계학술대회, 2012-04-12
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Related Researcher
- 박찬언PARK, CHAN EON
- Dept. of Chemical Enginrg