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Flex Lami-capsulation for Organic Electronic Devices

Title
Flex Lami-capsulation for Organic Electronic Devices
Authors
이태우박민호김호범임경근J.-Y.Kim
POSTECH Authors
이태우
Date Issued
6-Oct-2011
Publisher
한국고분자학회
URI
http://oasis.postech.ac.kr/handle/2014.oak/59055
Article Type
Conference
Citation
The Polymer Society of Korea, 2011-10-06
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이태우LEE, TAE WOO
Dept of Materials Science & Enginrg
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