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Enhanced Reliability of Cu Interconnector by using Impurity-Contolled Mo layer
- Title
- Enhanced Reliability of Cu Interconnector by using Impurity-Contolled Mo layer
- Date Issued
- 2008-06-25
- Publisher
- IFES
- Article Type
- Conference
- Citation
- T he 51st International Field Emission Symposium(IFES), 2008-06-25
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Related Researcher
- 박찬경PARK, CHAN GYUNG
- Dept of Materials Science & Enginrg