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Wafer-scale reliable switching memory based on 2-dimensional layered organic-inorganic halide perovskite SCIE SCOPUS

Title
Wafer-scale reliable switching memory based on 2-dimensional layered organic-inorganic halide perovskite
Authors
Seo, Ja-YoungChoi, JaehoKim, Huo-SeonKim, JaegyeomYang, June-MoCuhadar, CanHan, Ji SuKim, Seung-JooLee, DonghwaJang, Ho WonPark, Nam-Gyu
Date Issued
2017-10
Publisher
ROYAL SOC CHEMISTRY
Abstract
Recently, organic-inorganic halide perovskite (OHP) has been suggested as an alternative to oxides or chalcogenides in resistive switching memory devices due to low operating voltage, high ON/OFF ratio, and flexibility. The most studied OHP is 3-dimensional (3D) MAPbI(3). However, MAPbI(3) often exhibits less reliable switching behavior probably due to the uncontrollable random formation of conducting filaments. Here, we report the resistive switching property of 2-dimensional (2D) OHP and compare switching characteristics depending on structural dimensionality. The dimensionality is controlled by changing the composition of BA(2)MA(n-1)PbnI(3n+1) (BA = butylammonium, MA = methylammonium), where 2D is formed from n = 1, and 3D is formed from n = infinity. Quasi 2D compositions with n = 2 and 3 are also compared. Transition from a high resistance state (HRS) to a low resistance state (LRS) occurs at 0.25 x 10(6) V m(-1) for 2D BA(2)PbI(4) film, which is lower than those for quasi 2D and 3D. Upon reducing the dimensionality from 3D to 2D, the ON/OFF ratio significantly increases from 10(2) to 10(7), which is mainly due to the decreased HRS current. A higher Schottky barrier and thermal activation energy are responsible for the low HRS current. We demonstrate for the first time reliable resistive switching from 4 inch wafer-scale BA(2)PbI(4) thin film working at both room temperature and a high temperature of 87 degrees C, which strongly suggests that 2D OHP is a promising candidate for resistive switching memory.
Keywords
DIFFUSION; ENDURANCE; DEVICE; ENERGY
URI
https://oasis.postech.ac.kr/handle/2014.oak/50973
DOI
10.1039/c7nr05582j
ISSN
2040-3364
Article Type
Article
Citation
NANOSCALE, vol. 9, no. 40, page. 15278 - 15285, 2017-10
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이동화LEE, DONGHWA
Dept of Materials Science & Enginrg
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