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피부유래 탈세포화세포외기질 바이오잉크 제작과 3차원 세포프린팅 기술을 통한 시험관 내 모델과 이식용제제로의 응용

Title
피부유래 탈세포화세포외기질 바이오잉크 제작과 3차원 세포프린팅 기술을 통한 시험관 내 모델과 이식용제제로의 응용
Authors
KONG, JEONG SIKBYOUNG, SOO KIMCHO, DONG WOO
Date Issued
2017-12-15
Publisher
사단법인 한국정밀공학회
Abstract
Currently, there are several commercialized tissue-engineered skin construct which have been used for wound graft and in vitro studies. However, currently used fabrication methods for tissue-engineered skin still have some limitations and issues in regards to long fabrication time, low accuracy, and inconsistent quality. Furthermore, it is difficult to fabricate ideal skin construct which contain pigments, perfusable vasculature, hair follicles, and so on, with widely used manual method. Recently, 3D cell printing technology has emerged as a useful tool since this technology enables us to distribute various biomaterials and build the constructs more elaborately. Most usually used bioink for 3D cell printing for tissue-engineered skin is collagen hydrogel. However, low mechanical properties and fast degradation rate are related with severe contraction and short life span of in vitro tissue-engineered skin model. Moreover, extracellular matrix of ideal skin is not only composed of collagen; it also contains other important skin extracellular matrix components including elastin, hyaluronic acid, and glycosaminoglycan. Therefore, collagen bioink has limitations in fully recapitulating the natural microenvironment of skin. Herein, we developed the skin-derived decellularized extracellular matrix (S-dECM) bioink to provide similar microenvironment to skin cells. Decellularization protocol was evaluated by biochemical assays and rheological analysis was performed to identify mechanical behavior of S-dECM bioink. Tissue-engineered skin made of S-dECM shows performance superior than collagen bioink in in vitro and in vivo experiment.
URI
https://oasis.postech.ac.kr/handle/2014.oak/41651
Article Type
Conference
Citation
한국정밀공학회 2017년도 추계학술대회, 2017-12-15
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조동우CHO, DONG WOO
Dept of Mechanical Enginrg
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