Sub-millimter and terahertz-wave packaging for large chip-width MMICs
SCIE
SCOPUS
- Title
- Sub-millimter and terahertz-wave packaging for large chip-width MMICs
- Authors
- Song, HJ; Matsuzaki, H; Yaita, M
- Date Issued
- 2016-06
- Publisher
- Institute of Electrical and Electronics Engineers
- Abstract
- We present novel waveguide packaging for sub-millimeter and terahertz-wave devices, which is suitable for large chip-width MMICs and doesn't require any additional fabrication process. With full electromagnetic simulation, we analyze possible wave modes in a rectangular waveguide with thin E-plane slits formed for inserting large-width MMICs into the split waveguide block and show that parasitic modes can be well suppressed by lossy and high-dielectric material. For a 1.1-mm-wide test IC in the 260-320 GHz band, measured transition loss is around 1 dB with more than 60 dB inter-port isolation.
- URI
- https://oasis.postech.ac.kr/handle/2014.oak/37308
- DOI
- 10.1109/LMWC.2016.2537789
- ISSN
- 1531-1309
- Article Type
- Article
- Citation
- IEEE Microwave and Wireless Components Letters, vol. 26, no. 6, page. 422 - 424, 2016-06
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