Compact THz LTCC Receiver Module for 300-GHz Wireless Communications
SCIE
SCOPUS
- Title
- Compact THz LTCC Receiver Module for 300-GHz Wireless Communications
- Authors
- Tajima, T; Song, HJ; Yaita, M
- Date Issued
- 2016-04
- Publisher
- Institute of Electrical and Electronics Engineers
- Abstract
- A compact, low-cost, fully-integrated package solution has been developed for 300 GHz short-range communication systems. Using low-temperature co-fired ceramic (LTCC) technology, an integrated reflector for the on-chip antenna and high-data-rate signal interconnections including a flip-chip and via transition are embedded in a package. A reduced-size silicon lens antenna is placed in a package cavity together with a flip-chip bonded receiver IC with an on-chip antenna. The overall size of the front-end receiver is only 10 x 10 x 4mm(3), including the 6 mm diameter silicon lens. This compact terahertz receiver, mounted on an evaluation board, demonstrated wireless links with data rates up to 27Gb/s.
- URI
- https://oasis.postech.ac.kr/handle/2014.oak/37306
- DOI
- 10.1109/LMWC.2016.2537044
- ISSN
- 1531-1309
- Article Type
- Article
- Citation
- IEEE Microwave and Wireless Components Letters, vol. 26, no. 4, page. 291 - 293, 2016-04
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