Flexible Lamination Encapsulation
SCIE
SCOPUS
- Title
- Flexible Lamination Encapsulation
- Authors
- Park, MH; Kim, JY; Han, TH; Kim, TS; Kim, H; Lee, TW
- Date Issued
- 2015-08-05
- Publisher
- WILEY-V C H VERLAG GMBH
- URI
- https://oasis.postech.ac.kr/handle/2014.oak/36350
- DOI
- 10.1002/ADMA.201501856
- ISSN
- 0935-9648
- Article Type
- Article
- Citation
- ADVANCED MATERIALS, vol. 27, no. 29, page. 4308 - 4314, 2015-08-05
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- There are no files associated with this item.
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