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DYNAMIC DEFORMATION AND FRACTURE BEHAVIOR OF ULTRA-FINE-GRAINED PURE COPPER FABRICATED BY EQUAL CHANNEL ANGULAR PRESSING SCIE SCOPUS

Title
DYNAMIC DEFORMATION AND FRACTURE BEHAVIOR OF ULTRA-FINE-GRAINED PURE COPPER FABRICATED BY EQUAL CHANNEL ANGULAR PRESSING
Authors
Kim, YGHwang, BLee, SLee, CWShin, DH
Date Issued
2009-03-25
Publisher
ELSEVIER SCIENCE SA
Abstract
Dynamic deformation and fracture behavior of ultra-fine-grained pure copper fabricated by equal channel angular pressing (ECAP) was investigated. The 1-pass ECAP'ed specimen consisted of fine dislocation cell structures, which were changed to very fine, equiaxed subgrains of 300-400 nm in size with increasing number of ECAP pass. The dynamic torsional test results indicated that maximum shear stress increased with increasing number of pass, but that the rate of the strength increase was higher in the 4-pass or 8-pass specimen than in the 1-pass specimen. This was because boundaries of subgrains formed during the 4-pass or 8-pass ECAP were more stabilized and high angled. Most of the ultra-fine-grained pure copper specimens were not fractured because adiabatic shear bands were hardly formed as the pure copper specimens were ductile and had high thermal conductivity, although a weak adiabatic shear band was observed in the 8-pass specimen. These findings suggested that the grain refinement by the ECAP was effective in strengthening of pure copper, and that the ECAP'ed pure copper could be used without much loss in fracture resistance under dynamic loading. (C) 2008 Elsevier B.V. All rights reserved.
Keywords
Dynamic torsional test; Ultra-fine-grained pure copper; Equal channel angular pressing (ECAP); STACKING-FAULT ENERGY; LOW-CARBON STEELS; TORSIONAL DEFORMATION; MECHANICAL-PROPERTIES; TENSILE DEFORMATION; PLASTIC-DEFORMATION; ALLOYS; STRAIN
URI
https://oasis.postech.ac.kr/handle/2014.oak/28266
DOI
10.1016/j.msea.2008.10.043
ISSN
0921-5093
Article Type
Article
Citation
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, vol. 504, no. 39815, page. 163 - 168, 2009-03-25
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이성학LEE, SUNG HAK
Dept of Materials Science & Enginrg
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