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Applications of atomic layer deposition to nanofabrication and emerging nanodevices SCIE SCOPUS

Title
Applications of atomic layer deposition to nanofabrication and emerging nanodevices
Authors
Kim, HLee, HBRMaeng, WJ
Date Issued
2009-02-27
Publisher
ELSEVIER SCIENCE SA
Abstract
Recently, with scaling down of semiconductor devices, need for nanotechnology has increased enormously. For nanoscale devices especially, each of the layers should be as thin and as perfect as possible. Thus, the application of atomic layer deposition (ALD) to nanofabrication strategies and emerging nanodevices has sparked a good deal of interest due to its inherent benefits compared to other thin film deposition techniques. Since the ALD process is intrinsically atomic in nature and results in the controlled deposition of films at the atomic scale, ALD produces layers with nanometer scale thickness control and excellent conformality. In this report, we review current research trends in ALD processes, focusing on the application of ALD to emerging nanodevices utilizing fabrication through nanotechnology. (C) 2008 Elsevier B.V. All rights reserved.
Keywords
Nanotechnology; Nanofabrication; Atomic layer deposition; Nanotemplate; Nanodevice; Self-assembly; SELF-ASSEMBLED MONOLAYERS; FIELD-EFFECT TRANSISTORS; KAPPA GATE DIELECTRICS; SEQUENTIAL SURFACE-REACTIONS; SENSITIZED SOLAR-CELLS; NITRIDE INVERSE OPALS; OXIDE NANOTUBE ARRAYS; THIN-FILMS; PHOTONIC CRYSTALS; CARBON NANOTUBES
URI
https://oasis.postech.ac.kr/handle/2014.oak/26495
DOI
10.1016/J.TSF.2008.09.007
ISSN
0040-6090
Article Type
Article
Citation
THIN SOLID FILMS, vol. 517, no. 8, page. 2563 - 2580, 2009-02-27
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김형준KIM, HYUNGJUN
Dept of Materials Science & Enginrg
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