Control of the electrical and adhesion properties of metal/organic interfaces with self-assembled monolayers
SCIE
SCOPUS
- Title
- Control of the electrical and adhesion properties of metal/organic interfaces with self-assembled monolayers
- Authors
- Cho, JH; Lim, JA; Han, JT; Jang, HW; Lee, JL; Cho, K
- Date Issued
- 2005-04-25
- Publisher
- AMER INST PHYSICS
- Abstract
- With the aim of improving the electrical and adhesion properties of a noble-metal electrode (Ag)/ organic interface, a SH-terminated self-assembled monolayer (SAM) that reacts with the silver atoms of the electrode was tested. Silver atoms deposited on the SH-modified surface were found to bind strongly to the terminal sulfur atoms as a result of the reaction between sulfur and silver. In contrast, silver atoms deposited onto a CH3-modified surface do not react with the SAM. The specific contact resistance of the interface between the SH-terminated surface and the silver electrode (1.31 X 10(-2) Omega cm(2)) was found to be much lower than that of the silver thin film deposited on the CH3-modified surface (495.58 Omega cm(2)). (c) 2005 American Institute of Physics.
- URI
- https://oasis.postech.ac.kr/handle/2014.oak/24591
- DOI
- 10.1063/1.191461
- ISSN
- 0003-6951
- Article Type
- Article
- Citation
- APPLIED PHYSICS LETTERS, vol. 86, no. 17, 2005-04-25
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