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Reappraisal of grain boundary diffusion creep equations for nanocrystalline materials SCIE SCOPUS KCI

Title
Reappraisal of grain boundary diffusion creep equations for nanocrystalline materials
Authors
Park, KTLee, CSShin, DHLee, YSNam, WJ
Date Issued
2006-04
Publisher
KOREAN INST METALS MATERIALS
Abstract
Grain boundary diffusion creep equations developed previously for nanocrystalline materials were reappraised in order to elicit further understanding of plastic deformation of these materials in relation to grain boundary diffusion. From a mechanistic viewpoint, the strain rate is inversely proportional to the second power of the grain size when the grain size is refined to the same order of the grain boundary thickness. The presence of the threshold stress appears to be inherent, as a relatively large volume fraction of the grain boundary region is associated with irregularities.
Keywords
nanocrystalline materials; grain boundary diffusion creep; grain size; threshold stress; HIGH-TEMPERATURE DEFORMATION; PURE COPPER; MECHANICAL-PROPERTIES; BEHAVIOR; AL; CU; PALLADIUM; MODEL; PD
URI
https://oasis.postech.ac.kr/handle/2014.oak/24051
DOI
10.1007/BF03027465
ISSN
1598-9623
Article Type
Article
Citation
METALS AND MATERIALS INTERNATIONAL, vol. 12, no. 2, page. 107 - 113, 2006-04
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이종수LEE, CHONG SOO
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