Bulk-micromachined circular foil type micro heat-flux sensor
SCIE
SCOPUS
- Title
- Bulk-micromachined circular foil type micro heat-flux sensor
- Authors
- Oh, SH; Lee, SH; Jeon, JC; Kim, MH; Lee, SS
- Date Issued
- 2006-11-20
- Publisher
- ELSEVIER SCIENCE SA
- Abstract
- A micro heat-flux sensor with high sensitivity under conditions of low heat flux has been designed, bulk-micromachined and tested in a convective environment. The sensor, which is based on the circular foil type heat-flux sensor, is composed of thermal paths and a thermopile. Thermal path layers of electroplated copper on both sides of a wafer are connected through a bulk-micromachined window. A thermopile consisting of a series of n thermocouples is used to get an n-fold output compared to a single couple. When the sensor is placed on a high temperature wall, heat flux from the wall flows through thermal paths and drains out to the environment, producing a temperature difference along these paths. The heat flux is obtained by measuring the temperature difference using a thermopile of Ni-Cr thermocouples. The calibrated sensitivity of the micro heat-flux sensor is 0.17-1.90 mu V/(mW cm(-2)) in the heat flux range 0-180 mW/cm(2). (c) 2005 Elsevier B.V. All rights reserved.
- Keywords
- heat flux; bulk-micromachining; copper electroplating; circular foil gauge; convective environment
- URI
- https://oasis.postech.ac.kr/handle/2014.oak/23693
- DOI
- 10.1016/j.sna.2003.02.001
- ISSN
- 0924-4247
- Article Type
- Article
- Citation
- SENSORS AND ACTUATORS A-PHYSICAL, vol. 132, no. 2, page. 581 - 586, 2006-11-20
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