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Evaluation of epoxy underfill materials for solder flip-chip technology SCIE SCOPUS
- Title
- Evaluation of epoxy underfill materials for solder flip-chip technology
- Date Issued
- 1997-06-15
- Publisher
- CHAPMAN HALL LTD
- ISSN
- 0261-8028
- Article Type
- Article
- Citation
- JOURNAL OF MATERIALS SCIENCE LETTERS, vol. 16, no. 12, page. 1027 - 1029, 1997-06-15
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Related Researcher
- 박찬언PARK, CHAN EON
- Dept. of Chemical Enginrg