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High-temperature deformation behavior of a gamma TiAl alloy-microstructural evolution and mechanisms

Title
High-temperature deformation behavior of a gamma TiAl alloy-microstructural evolution and mechanisms
Authors
Kim, JHHa, TKChang, YWLee, CS장영원
Date Issued
2003-10
Publisher
TMS
Abstract
The present investigation was carried out in the context of the internal-variable theory of inelastic deformation and the dynamic-materials model (DMM), to shed light on the high-temperature deformation mechanisms in TiAl. A series of load-relaxation tests and tensile tests were conducted on a fine-grained duplex gamma TiAl alloy at temperatures ranging from 800 degreesC to 1050 degreesC. Results of the load-relaxation tests, in which the deformation took place at an infinitesimal level (epsilon congruent to 0.05), showed that the deformation behavior of the alloy was well described by the sum of dislocation-glide and dislocation-climb processes. To investigate the deformation behavior of the fine-grained duplex gamma TiAl alloy at a finite strain level, processing maps were constructed on the basis of a DMM. For this purpose, compression tests were carried out at temperatures ranging from 800 degreesC to 1250 degreesC using strain rates ranging from 10 to 10(-4)/s. Two domains were identified and characterized in the processing maps obtained at finite strain levels (0.2 and 0.6). One domain was found in the region of 980 degreesC and 10(-3)/s with a peak efficiency (maximum efficiency of power dissipation) of 48 pct and was identified as a domain of dynamic recrystallization (DRx) from microstructural observations. Another domain with a peak efficiency of 64 pct was located in the region of 1250 degreesC and 10(-4)/s and was considered to be a domain of superplasticity.
Keywords
HOT DEFORMATION; DYNAMIC RECRYSTALLIZATION; SUPERPLASTIC DEFORMATION; TITANIUM ALUMINIDE; PROCESSING MAP; ACCOMMODATION MODE; CREEP DEFORMATION; TI-6AL-4V ALLOY; WORKING; STRESS
URI
https://oasis.postech.ac.kr/handle/2014.oak/18313
ISSN
1073-5623
Article Type
Conference
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