Enhancement of physical and chemical properties of thin film Ag/AgCl reference electrode using a Ni buffer layer
SCIE
SCOPUS
- Title
- Enhancement of physical and chemical properties of thin film Ag/AgCl reference electrode using a Ni buffer layer
- Authors
- Kim, HR; Kim, YD; Kim, KI; Shim, JH; Nam, H; Kang, BK
- Date Issued
- 2004-02-01
- Publisher
- ELSEVIER SCIENCE SA
- Abstract
- The effect of diffusion and oxidation of Ti on the physical and chemical properties of the thin film Ag/AgCl reference electrode is investigated using three different thin film structures: the Si/SiO2/Ag/AgCl, Si/SiO2/Ti/Ag/AgCl, and Si/SiO2/Ti/Ni/Ag/AgCl structures. The experimental evidences indicate that the pores on the AgCl layer are the major cause of shortening the durability of the reference electrode in a solution of high Cl- concentration. The Ni buffer layer is very effective on reducing the diffusion of Ti and O atoms into the Ag layer, results in a relatively pore free Ag/AgCl surface, and improves the physical and chemical properties of the electrode significantly. In a saturated 3.5 M KCl solution, the durability of the reference electrode with the Ni buffer layer is increased to similar to2 h, while that without the Ni buffer layer is 4-5 min. (C) 2003 Elsevier B.V. All rights reserved.
- Keywords
- pH sensor; reference electrode; Ag/AgCl; thin film reference electrode; FABRICATION; SENSORS
- URI
- https://oasis.postech.ac.kr/handle/2014.oak/18106
- DOI
- 10.1016/J/SNB.2003.09.010
- ISSN
- 0925-4005
- Article Type
- Article
- Citation
- SENSORS AND ACTUATORS B-CHEMICAL, vol. 97, no. 2-3, page. 348 - 354, 2004-02-01
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- There are no files associated with this item.
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