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Interface engineering for low power and uniform resistive switching in bi-layer structural filament type ReRAM SCIE SCOPUS

Title
Interface engineering for low power and uniform resistive switching in bi-layer structural filament type ReRAM
Authors
Lee, DWoo, JCha, EKim, SLee, WPark, SHwang, H
Date Issued
2013-09
Publisher
Elsevier
Abstract
In bi-layer structural ReRAM, resistive switching behaviors strongly depend on condition of interfacial layer between oxygen absorption layer and active layer. The condition of interfacial layer is investigated to improve the resistive switching behaviors of bi-layer structural ReRAM. By changing deposition ambient of the oxygen absorption layer, in low power operation, more stable and larger on/off ratio were achieved. Based on the results of electrical and physical analyses, the oxygen content difference of active layer is considered as a dominant origin. (C) 2013 Elsevier B.V. All rights reserved.
Keywords
RRAM; Interface engineering; Uniformity; Low power operation; Bi-layer structure; ZROX/HFOX STACKS; MEMORY; MODEL
URI
https://oasis.postech.ac.kr/handle/2014.oak/14933
DOI
10.1016/J.MEE.2013.03.148
ISSN
0167-9317
Article Type
Article
Citation
Microelectronic Engineering, vol. 109, page. 385 - 388, 2013-09
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