Effect of Post-annealing on Grain Boundary of Nano-crystalline Cu Processed by Powder High-Pressure Torsion
SCIE
SCOPUS
- Title
- Effect of Post-annealing on Grain Boundary of Nano-crystalline Cu Processed by Powder High-Pressure Torsion
- Authors
- EUN YOO YOON; DONG JUN LEE; LEE JU PARK; Lee, S; Abd El Aal, MI; Kim, HS
- Date Issued
- 2014-10
- Publisher
- SPRINGER
- Abstract
- High tensile strength of 616 MPa and improved ductility of 7.6 pct were obtained in powder-consolidated pure Cu processed by high-pressure torsion (HPT) at room temperature followed by post-annealing at 673 K (400 A degrees C). The powder-HPT consolidation process maintained nano-crystalline microstructures even after post-annealing due to the presence of well-dispersed oxide particles in the matrix. Higher ductility in the post-annealed specimen is attributed to higher fraction of stable I 3 pound coincidence site lattice boundaries than that in the HPT-processed Cu.
- URI
- https://oasis.postech.ac.kr/handle/2014.oak/14182
- DOI
- 10.1007/S11661-014-2466-Z
- ISSN
- 1073-5623
- Article Type
- Article
- Citation
- METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, vol. 45A, no. 11, page. 4748 - 4752, 2014-10
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