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dc.contributor.authorLee, D-
dc.contributor.authorWoo, J-
dc.contributor.authorCha, E-
dc.contributor.authorLee, S-
dc.contributor.authorHwang, H-
dc.date.accessioned2016-03-31T07:23:57Z-
dc.date.available2016-03-31T07:23:57Z-
dc.date.created2015-02-26-
dc.date.issued2014-09-
dc.identifier.issn0361-5235-
dc.identifier.other2014-OAK-0000032335-
dc.identifier.urihttps://oasis.postech.ac.kr/handle/2014.oak/13589-
dc.description.abstractAccurate control of formation of conducting filaments is one of the most important challenges to solve in order to achieve improved switching characteristics in resistive random-access memory (ReRAM). In this regard, high-pressure hydrogen annealing (HPHA) can be an effective method for accurate control because it can induce in the ReRAM the formation of oxygen vacancies and OH- bonds, the main factors that influence conducting filament formation. Among the various switching processes, the forming process, which represents the first formation of a conducting filament, was investigated to clarify the effects of HPHA on the formation of conducting filaments. HPHA-treated samples were found to exhibit more accurately controlled resistance of the conducting filament, owing to accurate control of the forming process, compared with samples not treated by HPHA.-
dc.description.statementofresponsibilityX-
dc.languageEnglish-
dc.publisherSpringer-
dc.relation.isPartOfJOURNAL OF ELECTRONIC MATERIALS-
dc.subjectReRAM-
dc.subjectconducting filament-
dc.subjecthigh-pressure hydrogen annealing-
dc.subjectfilament overformation-
dc.subjectTECHNOLOGY-
dc.titleEffects of High-Pressure Hydrogen Annealing on the Formation of Conducting Filaments in Filament-Type Resistive Random-Access Memory-
dc.typeArticle-
dc.contributor.college신소재공학과-
dc.identifier.doi10.1007/S11664-014-3265-4-
dc.author.googleLee, D-
dc.author.googleWoo, J-
dc.author.googleCha, E-
dc.author.googleLee, S-
dc.author.googleHwang, H-
dc.relation.volume43-
dc.relation.issue9-
dc.relation.startpage3635-
dc.relation.lastpage3639-
dc.contributor.id10079928-
dc.relation.journalJOURNAL OF ELECTRONIC MATERIALS-
dc.relation.indexSCI급, SCOPUS 등재논문-
dc.relation.sciSCI-
dc.collections.nameJournal Papers-
dc.type.rimsART-
dc.identifier.bibliographicCitationJOURNAL OF ELECTRONIC MATERIALS, v.43, no.9, pp.3635 - 3639-
dc.identifier.wosid000340363600074-
dc.date.tcdate2019-01-01-
dc.citation.endPage3639-
dc.citation.number9-
dc.citation.startPage3635-
dc.citation.titleJOURNAL OF ELECTRONIC MATERIALS-
dc.citation.volume43-
dc.contributor.affiliatedAuthorHwang, H-
dc.identifier.scopusid2-s2.0-84906316931-
dc.description.journalClass1-
dc.description.journalClass1-
dc.description.wostc1-
dc.description.scptc1*
dc.date.scptcdate2018-05-121*
dc.type.docTypeArticle-
dc.subject.keywordAuthorReRAM-
dc.subject.keywordAuthorconducting filament-
dc.subject.keywordAuthorhigh-pressure hydrogen annealing-
dc.subject.keywordAuthorfilament overformation-
dc.relation.journalWebOfScienceCategoryEngineering, Electrical & Electronic-
dc.relation.journalWebOfScienceCategoryMaterials Science, Multidisciplinary-
dc.relation.journalWebOfScienceCategoryPhysics, Applied-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.relation.journalResearchAreaEngineering-
dc.relation.journalResearchAreaMaterials Science-
dc.relation.journalResearchAreaPhysics-

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