Electrochemical Ultrathin Metal‐Atomic Layer Deposition for Silica Microenvironment‐Assisted Cu‐Based Catalysis
SCIE
SCOPUS
- Title
- Electrochemical Ultrathin Metal‐Atomic Layer Deposition for Silica Microenvironment‐Assisted Cu‐Based Catalysis
- Authors
- Jeevanandham, Sampathkumar; Maji, Ankur; Acharya, Anubhab; Kumari, Nitee; Gu, Byeong Su; Yoon, Youngkwan; Choi, Hee Cheul; Kumar, Amit; Lee, In Su
- Date Issued
- 2024-03
- Publisher
- John Wiley & Sons Ltd.
- Abstract
- Replacing commonly used precious and rare noble metals by the abundant copper (Cu)-based catalysts is highly desired for sustainable fine-chemical synthesis. However, in the lack of model platforms, complex surface chemistry of randomly nanostructured bulk Cu is notoriously challenging to understand and control. By synthesizing ultrathin 2D-Cu layer sandwiched inside the bilayer silica template, an unusual but critical cooperative role of Lewis basic amino-silica microenvironment for [Cu]-catalyzed selective hydrogenation of unsaturated C─C bonds in diverse alkynes, ene-ynes, and α,β-unsaturated (alkene) Michael acceptors is discovered. Newly developed nanospace-confined electrochemical (eChem) atomic layer deposition (NC-EAD) technique afforded < 2 nm ultrathin Cu(0)-layer intimately covered inside silica envelope. This model platform aided the detailed mechanistic study deciphering the unexpected finding – originally non-reactive Cu-film, just by a simple silica coating step, turning into an efficient catalyst for scalable fine-chemical synthesis. The concept of reactive metal surface-microenvironment manipulation, presents a new paradigm for controlling complex molecular interactions in heterogeneous catalysts. © 2023 Wiley-VCH GmbH.
- URI
- https://oasis.postech.ac.kr/handle/2014.oak/119779
- DOI
- 10.1002/adfm.202311752
- ISSN
- 1616-301X
- Article Type
- Article
- Citation
- Advanced Functional Materials, vol. 34, no. 12, 2024-03
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- There are no files associated with this item.
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