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Issues and key technologies for next generation 3D NAND
- Title
- Issues and key technologies for next generation 3D NAND
- Date Issued
- 2021-01-20
- Publisher
- Institute of Electrical and Electronics Engineers Inc.
- Abstract
- In this paper, design challenges and key technologies to overcome the hurdles for the future 3D NAND are introduced. More specifically, state-of-the-art solutions for higher density, lower cost and higher bandwidth NAND is covered in detail.
- Article Type
- Conference
- Citation
- 2021 International Conference on Electronics, Information, and Communication, ICEIC 2021, 2021-01-20
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Related Researcher
- 이선규Lee, Seon Kyoo
- Department of Semiconductor Engineering