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Effect of Carbon Implantation on Thermal Stability of Metal-Insulator-Semiconductor Contact Using TiO2 interfacial layer
- Title
- Effect of Carbon Implantation on Thermal Stability of Metal-Insulator-Semiconductor Contact Using TiO2 interfacial layer
- Authors
- LEE, JEONG SOO; PARK, IKSOO; KIM, JUNGSIK; LEE, DONGHUN
- Date Issued
- 2022-01
- Publisher
- 한국반도체학술대회
- Article Type
- Conference
- Citation
- 제29회 한국반도체학술대회, 2022-01
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Related Researcher
- 이정수LEE, JEONG SOO
- Dept of Electrical Enginrg