Engineering Grain Boundaries in Two‐Dimensional Electronic Materials
SCIE
SCOPUS
- Title
- Engineering Grain Boundaries in Two‐Dimensional Electronic Materials
- Authors
- YANG, SEONGJUN; 최민영; 김철주
- Date Issued
- 2022-07
- Publisher
- WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim
- Abstract
- Engineering the boundary structures in 2D materials provides an unprecedented opportunity to program the physical properties of the materials with extensive tunability and realize innovative devices with advanced functionalities. However, structural engineering technology is still in its infancy, and creating artificial boundary structures with high reproducibility remains difficult. In this review, various emergent properties of 2D materials with different grain boundaries, and the current techniques to control the structures, are introduced. The remaining challenges for scalable and reproducible structure control and the outlook on the future directions of the related techniques are also discussed.
- URI
- https://oasis.postech.ac.kr/handle/2014.oak/114522
- DOI
- 10.1002/adma.202203425
- ISSN
- 0935-9648
- Article Type
- Article
- Citation
- Advanced Materials, page. 2203425, 2022-07
- Files in This Item:
- There are no files associated with this item.
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.