Invited Paper: Flexible Substrate Engineering to Enhance Bending Stability
- Title
- Invited Paper: Flexible Substrate Engineering to Enhance Bending Stability
- Authors
- CHUNG, YOONYOUNG; Park, Seongmin; PARK, HYUK
- Date Issued
- 2018-05
- Publisher
- Wiley
- Abstract
- We propose a novel substrate structure to achieve excellent mechanical flexibility. Electronic components on a flexible substrate are affected by surface strain when bent. Our flexible substrate contains a strain-absorbing layer that can effectively reduce the surface strain; thus, flexible devices can be more flexible with minimal electrical degradation.
- URI
- https://oasis.postech.ac.kr/handle/2014.oak/108503
- DOI
- 10.1002/sdtp.12245
- ISSN
- 0097-966X
- Article Type
- Article
- Citation
- Digest of Technical Papers - SID International Symposium, vol. 49, no. 1, page. 892 - 894, 2018-05
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- There are no files associated with this item.
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