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Invited Paper: Flexible Substrate Engineering to Enhance Bending Stability

Title
Invited Paper: Flexible Substrate Engineering to Enhance Bending Stability
Authors
CHUNG, YOONYOUNGPark, SeongminPARK, HYUK
Date Issued
2018-05
Publisher
Wiley
Abstract
We propose a novel substrate structure to achieve excellent mechanical flexibility. Electronic components on a flexible substrate are affected by surface strain when bent. Our flexible substrate contains a strain-absorbing layer that can effectively reduce the surface strain; thus, flexible devices can be more flexible with minimal electrical degradation.
URI
https://oasis.postech.ac.kr/handle/2014.oak/108503
DOI
10.1002/sdtp.12245
ISSN
0097-966X
Article Type
Article
Citation
Digest of Technical Papers - SID International Symposium, vol. 49, no. 1, page. 892 - 894, 2018-05
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정윤영CHUNG, YOONYOUNG
Dept of Electrical Enginrg
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