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KIM, DONG SUNG(김동성) orcid scopus
Department
Dept of Mechanical Engineering(기계공학과)
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    Publication & Time Cited Count (For the Last 5 years)

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    Author : 626 Date Issued : 2008
    Article
    Collapse-Free Thermal Bonding Technique for Large Area Microchambers in Plastic Lab-on-a-Chip ApplicationsSCIESCOPUS

    MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, vol. 14, no. 2, page. 179 - 184, 2008-02

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