Open Access System for Information Sharing

Login Library

 

Conference
Cited 0 time in webofscience Cited 0 time in scopus
Metadata Downloads
Full metadata record
Files in This Item:
There are no files associated with this item.
DC FieldValueLanguage
dc.contributor.author박홍준-
dc.date.accessioned2018-06-21T05:20:18Z-
dc.date.available2018-06-21T05:20:18Z-
dc.date.created2009-03-27-
dc.date.issued2004-10-01-
dc.identifier.urihttps://oasis.postech.ac.kr/handle/2014.oak/74957-
dc.publisherIT-SoC-
dc.relation.isPartOfInternational SoC Design Conference-
dc.relation.isPartOfInternational SoC Design Conference-
dc.titleExtraction of SPICE Parameters for Through-Hole Via Using a Regular VNA Measurement on Via-TL-Via Structure for Use in DRAM DIMM Modeling-
dc.typeConference-
dc.type.rimsCONF-
dc.identifier.bibliographicCitationInternational SoC Design Conference, pp.164 - 167-
dc.citation.conferenceDate2004-10-25-
dc.citation.endPage167-
dc.citation.startPage164-
dc.citation.titleInternational SoC Design Conference-
dc.contributor.affiliatedAuthor박홍준-
dc.description.journalClass1-
dc.description.journalClass1-

qr_code

  • mendeley

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.

Related Researcher

Researcher

박홍준PARK, HONG JUNE
Dept of Electrical Enginrg
Read more

Views & Downloads

Browse