Full metadata record
DC Field | Value | Language |
dc.contributor.author | 박홍준 | - |
dc.date.accessioned | 2018-06-21T05:20:18Z | - |
dc.date.available | 2018-06-21T05:20:18Z | - |
dc.date.created | 2009-03-27 | - |
dc.date.issued | 2004-10-01 | - |
dc.identifier.uri | https://oasis.postech.ac.kr/handle/2014.oak/74957 | - |
dc.publisher | IT-SoC | - |
dc.relation.isPartOf | International SoC Design Conference | - |
dc.relation.isPartOf | International SoC Design Conference | - |
dc.title | Extraction of SPICE Parameters for Through-Hole Via Using a Regular VNA Measurement on Via-TL-Via Structure for Use in DRAM DIMM Modeling | - |
dc.type | Conference | - |
dc.type.rims | CONF | - |
dc.identifier.bibliographicCitation | International SoC Design Conference, pp.164 - 167 | - |
dc.citation.conferenceDate | 2004-10-25 | - |
dc.citation.endPage | 167 | - |
dc.citation.startPage | 164 | - |
dc.citation.title | International SoC Design Conference | - |
dc.contributor.affiliatedAuthor | 박홍준 | - |
dc.description.journalClass | 1 | - |
dc.description.journalClass | 1 | - |
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