DC Field | Value | Language |
---|---|---|
dc.contributor.author | Oh, SH | - |
dc.contributor.author | Lee, KC | - |
dc.contributor.author | Chun, J | - |
dc.contributor.author | Kim, M | - |
dc.contributor.author | Lee, SS | - |
dc.date.accessioned | 2016-04-01T08:25:58Z | - |
dc.date.available | 2016-04-01T08:25:58Z | - |
dc.date.created | 2009-10-01 | - |
dc.date.issued | 2001-05 | - |
dc.identifier.issn | 0960-1317 | - |
dc.identifier.other | 2001-OAK-0000019075 | - |
dc.identifier.uri | https://oasis.postech.ac.kr/handle/2014.oak/27959 | - |
dc.description.abstract | A micro heat flux sensor which can measure the thermal energy transfer per unit area has been designed, fabricated, and calibrated in a convective environment. The sensor which is based on a circular foil gage is composed of thermal paths and a thermopile. The thermal path is made in a LIGA-like process of SU-8 high aspect ratio microstructures and electroplated copper layers. The thermopile, a series of thermocouples, is used to amplify the output signal as a thermometer. When the sensor is placed on a high-temperature wall, heat flux from the wall flows through thermal paths and drains out to the environment, producing a temperature difference along its paths. Heat flux is obtained by calibrating this temperature difference in the thermopile of Ni-Cr or Al-Chromel pairs. The sensitivity of the heat flux sensor of Ni-Cr and Al-Chromel pairs is in the range of 0.1-2.0 and 0.4-2.0 muV mW(-1) cm(-2), respectively, in the heat flux range of 0-180 mW cm(-2). | - |
dc.description.statementofresponsibility | X | - |
dc.language | English | - |
dc.publisher | IOP PUBLISHING LTD | - |
dc.relation.isPartOf | JOURNAL OF MICROMECHANICS AND MICROENGINEERING | - |
dc.title | Micro heat flux sensor using copper electroplating in SU-8 microstructures | - |
dc.type | Article | - |
dc.contributor.college | 기계공학과 | - |
dc.identifier.doi | 10.1088/0960-1317/11/3/310 | - |
dc.author.google | Oh, SH | - |
dc.author.google | Lee, KC | - |
dc.author.google | Chun, J | - |
dc.author.google | Kim, M | - |
dc.author.google | Lee, SS | - |
dc.relation.volume | 11 | - |
dc.relation.issue | 3 | - |
dc.relation.startpage | 221 | - |
dc.relation.lastpage | 225 | - |
dc.contributor.id | 10110703 | - |
dc.relation.journal | JOURNAL OF MICROMECHANICS AND MICROENGINEERING | - |
dc.relation.index | SCI급, SCOPUS 등재논문 | - |
dc.relation.sci | SCI | - |
dc.collections.name | Journal Papers | - |
dc.type.rims | ART | - |
dc.identifier.bibliographicCitation | JOURNAL OF MICROMECHANICS AND MICROENGINEERING, v.11, no.3, pp.221 - 225 | - |
dc.identifier.wosid | 000168904300010 | - |
dc.date.tcdate | 2019-02-01 | - |
dc.citation.endPage | 225 | - |
dc.citation.number | 3 | - |
dc.citation.startPage | 221 | - |
dc.citation.title | JOURNAL OF MICROMECHANICS AND MICROENGINEERING | - |
dc.citation.volume | 11 | - |
dc.contributor.affiliatedAuthor | Kim, M | - |
dc.identifier.scopusid | 2-s2.0-343773239 | - |
dc.description.journalClass | 1 | - |
dc.description.journalClass | 1 | - |
dc.description.wostc | 15 | - |
dc.type.docType | Article | - |
dc.relation.journalWebOfScienceCategory | Engineering, Electrical & Electronic | - |
dc.relation.journalWebOfScienceCategory | Nanoscience & Nanotechnology | - |
dc.relation.journalWebOfScienceCategory | Instruments & Instrumentation | - |
dc.relation.journalWebOfScienceCategory | Physics, Applied | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Engineering | - |
dc.relation.journalResearchArea | Science & Technology - Other Topics | - |
dc.relation.journalResearchArea | Instruments & Instrumentation | - |
dc.relation.journalResearchArea | Physics | - |
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