DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kim, DS | - |
dc.contributor.author | Kwang-Cheol Lee | - |
dc.contributor.author | KWON, TAI HUN | - |
dc.contributor.author | Seung S. Lee | - |
dc.date.accessioned | 2016-04-01T02:22:16Z | - |
dc.date.available | 2016-04-01T02:22:16Z | - |
dc.date.created | 2009-02-28 | - |
dc.date.issued | 2002-05 | - |
dc.identifier.issn | 0960-1317 | - |
dc.identifier.other | 2002-OAK-0000022941 | - |
dc.identifier.uri | https://oasis.postech.ac.kr/handle/2014.oak/25005 | - |
dc.description.abstract | Understanding filling flow into micro-channels is important in designing micro-injection molding, micro-fluidic devices and an MIMIC (micromolding in capillaries) process. In this paper, we investigated, both experimentally and numerically, 'transient filling' flow into micro-channels, which differs from steady-state completely 'filled' flow in micro-channels. An experimental flow visualization system was devised to facilitate observation of flow characteristics in filling into micro-channels. Three sets of micro-channels of various widths of different thicknesses (20, 30, and 40 p in) were fabricated using SU-8 on the silicon substrate to find a geometric effect with regard to pressure gradient, viscous force and, in particular, surface tension. A numerical analysis system has also been developed taking into account the surface tension effect with a contact angle concept. Experimental observations indicate that surface tension significantly affects the filling flow to such an extent that even a flow blockage phenomenon was observed at channels of small width and thickness. A numerical analysis system also confirms that the flow blockage phenomenon could take place due to the flow hindrance effect of surface tension, which is consistent with experimental observation. For proper numerical simulations, two correction factors have also been proposed to correct the conventional hydraulic radius for the filling flow in rectangular cross-sectioned channels. | - |
dc.description.statementofresponsibility | X | - |
dc.language | English | - |
dc.publisher | IOP PUBLISHING LTD | - |
dc.relation.isPartOf | JOURNAL OF MICROMECHANICS AND MICROENGINEERING | - |
dc.title | Micro-channel filling flow considering surface tension effect | - |
dc.type | Article | - |
dc.contributor.college | 기계공학과 | - |
dc.identifier.doi | 10.1088/0960-1317/12/3/307 | - |
dc.author.google | Kim, DS | - |
dc.author.google | Lee, KC | - |
dc.author.google | Kwon, TH | - |
dc.author.google | Lee, SS | - |
dc.relation.volume | 12 | - |
dc.relation.issue | 3 | - |
dc.relation.startpage | 236 | - |
dc.relation.lastpage | 246 | - |
dc.contributor.id | 10170232 | - |
dc.relation.journal | JOURNAL OF MICROMECHANICS AND MICROENGINEERING | - |
dc.relation.index | SCI급, SCOPUS 등재논문 | - |
dc.relation.sci | SCI | - |
dc.collections.name | Journal Papers | - |
dc.type.rims | ART | - |
dc.identifier.bibliographicCitation | JOURNAL OF MICROMECHANICS AND MICROENGINEERING, v.12, no.3, pp.236 - 246 | - |
dc.identifier.wosid | 000176057700007 | - |
dc.date.tcdate | 2019-02-01 | - |
dc.citation.endPage | 246 | - |
dc.citation.number | 3 | - |
dc.citation.startPage | 236 | - |
dc.citation.title | JOURNAL OF MICROMECHANICS AND MICROENGINEERING | - |
dc.citation.volume | 12 | - |
dc.contributor.affiliatedAuthor | Kim, DS | - |
dc.contributor.affiliatedAuthor | KWON, TAI HUN | - |
dc.identifier.scopusid | 2-s2.0-0036572852 | - |
dc.description.journalClass | 1 | - |
dc.description.journalClass | 1 | - |
dc.description.wostc | 93 | - |
dc.type.docType | Article | - |
dc.relation.journalWebOfScienceCategory | Engineering, Electrical & Electronic | - |
dc.relation.journalWebOfScienceCategory | Nanoscience & Nanotechnology | - |
dc.relation.journalWebOfScienceCategory | Instruments & Instrumentation | - |
dc.relation.journalWebOfScienceCategory | Physics, Applied | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Engineering | - |
dc.relation.journalResearchArea | Science & Technology - Other Topics | - |
dc.relation.journalResearchArea | Instruments & Instrumentation | - |
dc.relation.journalResearchArea | Physics | - |
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