Effect of surface treatment by (NH4)(2)S-x solution on the reduction of ohmic contact resistivity of p-type GaN

Abstract

Surface treatment using aqua regia and (NH4)(2)S-x solution in sequence prior to Pd metal deposition was effective in reducing the contact resistivity of Pd to p-type GaN. The contact resistivity was drastically decreased front 3.6 x 10(-1) to 2.9 x 10(-4) Ohm cm(2) by the treatment. The surface oxides formed on p-type GaN during epitaxial growth were effectively removed using aqua regia, and the following (NH4)(2)S-x treatment protected the surface from the formation of oxides during air exposure. The reduction of the contact resistivity is due to the direct contact of Pd to the clean surface of p-type GaN, via shift of the Fermi level to an energy level near the valence band, resulting in the reduction of the barrier height for holes at the interface of Pd/p-type GaN. (C) 1999 American Vacuum Society. [S0734-211X(99)03702-6].