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Cited 16 time in webofscience Cited 22 time in scopus
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dc.contributor.authorPark, JS-
dc.contributor.authorGianch-
dc.contributor.authorani, YB-
dc.date.accessioned2016-03-31T09:35:08Z-
dc.date.available2016-03-31T09:35:08Z-
dc.date.created2011-07-19-
dc.date.issued2003-04-
dc.identifier.issn1057-7157-
dc.identifier.other2003-OAK-0000023748-
dc.identifier.urihttps://oasis.postech.ac.kr/handle/2014.oak/17365-
dc.description.abstractA silicon-micromachined servo-controlled capacitive pressure sensor is described. The use of a capped-cylinder shape with pick-off electrodes external to a sealed cavity permits this device to be fabricated in only three masking steps. Device behavior is evaluated experimentally and by finite element analysis. A fabricated device with 2 mm diameter, 9.7 mum structural thickness and 10 mum cavity height provides a measured sensitivity of 0.516 V/kPa over a dynamic range of 20-100 kPa gauge pressure, with a nonlinearity of <3.22% of full scale. The open-loop sensitivity of this device averaged over a dynamic range of 0-250 kPa is -408 ppm/kPa. A voltage bias applied to the servo-electrode can be used to tune both the open-loop and servo-controlled sensitivity by more than 30%. An alternative design in which the Si electrode is segmented to relieve residual stress provides 10-20% more open-loop sensitivity with similar structural dimensions. Fabricated devices are sealed within a metal package filled with an inert dielectric liquid. This enhanced open-loop sensitivity by a factor of about 1.7, and in servo-controlled operation, reduced restoring voltage by a similar factor. Measurements and analysis of temperature responses of these devices are presented.-
dc.description.statementofresponsibilityX-
dc.languageEnglish-
dc.publisherIEEE/ASME-
dc.relation.isPartOfJOURNAL OF MICROELECTROMECHANICAL SYSTEMS-
dc.subjectdissolved wafer process-
dc.subjectliquid encapsulation-
dc.subjectpressure sensor-
dc.subjectservo-controller-
dc.titleA servo-controlled capacitive pressure sensor using a capped-cylinder structure microfabricated by a three-mask process-
dc.typeArticle-
dc.contributor.college기계공학과-
dc.identifier.doi10.1109/JMEMS.2003.809953-
dc.author.googlePark, JS-
dc.author.googleGianchandani, YB-
dc.relation.volume12-
dc.relation.issue2-
dc.relation.startpage209-
dc.relation.lastpage220-
dc.contributor.id10093923-
dc.relation.journalJOURNAL OF MICROELECTROMECHANICAL SYSTEMS-
dc.relation.indexSCI급, SCOPUS 등재논문-
dc.relation.sciSCI-
dc.collections.nameJournal Papers-
dc.type.rimsART-
dc.identifier.bibliographicCitationJOURNAL OF MICROELECTROMECHANICAL SYSTEMS, v.12, no.2, pp.209 - 220-
dc.identifier.wosid000182054900011-
dc.date.tcdate2019-01-01-
dc.citation.endPage220-
dc.citation.number2-
dc.citation.startPage209-
dc.citation.titleJOURNAL OF MICROELECTROMECHANICAL SYSTEMS-
dc.citation.volume12-
dc.contributor.affiliatedAuthorPark, JS-
dc.identifier.scopusid2-s2.0-0037387785-
dc.description.journalClass1-
dc.description.journalClass1-
dc.description.wostc13-
dc.description.scptc17*
dc.date.scptcdate2018-05-121*
dc.type.docTypeArticle-
dc.subject.keywordAuthordissolved wafer process-
dc.subject.keywordAuthorliquid encapsulation-
dc.subject.keywordAuthorpressure sensor-
dc.subject.keywordAuthorservo-controller-
dc.relation.journalWebOfScienceCategoryEngineering, Electrical & Electronic-
dc.relation.journalWebOfScienceCategoryNanoscience & Nanotechnology-
dc.relation.journalWebOfScienceCategoryInstruments & Instrumentation-
dc.relation.journalWebOfScienceCategoryPhysics, Applied-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.relation.journalResearchAreaEngineering-
dc.relation.journalResearchAreaScience & Technology - Other Topics-
dc.relation.journalResearchAreaInstruments & Instrumentation-
dc.relation.journalResearchAreaPhysics-

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박재성PARK, JAE SUNG
Dept of Mechanical Enginrg
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