DC Field | Value | Language |
---|---|---|
dc.contributor.author | Park, JS | - |
dc.contributor.author | Gianch | - |
dc.contributor.author | ani, YB | - |
dc.date.accessioned | 2016-03-31T09:35:08Z | - |
dc.date.available | 2016-03-31T09:35:08Z | - |
dc.date.created | 2011-07-19 | - |
dc.date.issued | 2003-04 | - |
dc.identifier.issn | 1057-7157 | - |
dc.identifier.other | 2003-OAK-0000023748 | - |
dc.identifier.uri | https://oasis.postech.ac.kr/handle/2014.oak/17365 | - |
dc.description.abstract | A silicon-micromachined servo-controlled capacitive pressure sensor is described. The use of a capped-cylinder shape with pick-off electrodes external to a sealed cavity permits this device to be fabricated in only three masking steps. Device behavior is evaluated experimentally and by finite element analysis. A fabricated device with 2 mm diameter, 9.7 mum structural thickness and 10 mum cavity height provides a measured sensitivity of 0.516 V/kPa over a dynamic range of 20-100 kPa gauge pressure, with a nonlinearity of <3.22% of full scale. The open-loop sensitivity of this device averaged over a dynamic range of 0-250 kPa is -408 ppm/kPa. A voltage bias applied to the servo-electrode can be used to tune both the open-loop and servo-controlled sensitivity by more than 30%. An alternative design in which the Si electrode is segmented to relieve residual stress provides 10-20% more open-loop sensitivity with similar structural dimensions. Fabricated devices are sealed within a metal package filled with an inert dielectric liquid. This enhanced open-loop sensitivity by a factor of about 1.7, and in servo-controlled operation, reduced restoring voltage by a similar factor. Measurements and analysis of temperature responses of these devices are presented. | - |
dc.description.statementofresponsibility | X | - |
dc.language | English | - |
dc.publisher | IEEE/ASME | - |
dc.relation.isPartOf | JOURNAL OF MICROELECTROMECHANICAL SYSTEMS | - |
dc.subject | dissolved wafer process | - |
dc.subject | liquid encapsulation | - |
dc.subject | pressure sensor | - |
dc.subject | servo-controller | - |
dc.title | A servo-controlled capacitive pressure sensor using a capped-cylinder structure microfabricated by a three-mask process | - |
dc.type | Article | - |
dc.contributor.college | 기계공학과 | - |
dc.identifier.doi | 10.1109/JMEMS.2003.809953 | - |
dc.author.google | Park, JS | - |
dc.author.google | Gianchandani, YB | - |
dc.relation.volume | 12 | - |
dc.relation.issue | 2 | - |
dc.relation.startpage | 209 | - |
dc.relation.lastpage | 220 | - |
dc.contributor.id | 10093923 | - |
dc.relation.journal | JOURNAL OF MICROELECTROMECHANICAL SYSTEMS | - |
dc.relation.index | SCI급, SCOPUS 등재논문 | - |
dc.relation.sci | SCI | - |
dc.collections.name | Journal Papers | - |
dc.type.rims | ART | - |
dc.identifier.bibliographicCitation | JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, v.12, no.2, pp.209 - 220 | - |
dc.identifier.wosid | 000182054900011 | - |
dc.date.tcdate | 2019-01-01 | - |
dc.citation.endPage | 220 | - |
dc.citation.number | 2 | - |
dc.citation.startPage | 209 | - |
dc.citation.title | JOURNAL OF MICROELECTROMECHANICAL SYSTEMS | - |
dc.citation.volume | 12 | - |
dc.contributor.affiliatedAuthor | Park, JS | - |
dc.identifier.scopusid | 2-s2.0-0037387785 | - |
dc.description.journalClass | 1 | - |
dc.description.journalClass | 1 | - |
dc.description.wostc | 13 | - |
dc.description.scptc | 17 | * |
dc.date.scptcdate | 2018-05-121 | * |
dc.type.docType | Article | - |
dc.subject.keywordAuthor | dissolved wafer process | - |
dc.subject.keywordAuthor | liquid encapsulation | - |
dc.subject.keywordAuthor | pressure sensor | - |
dc.subject.keywordAuthor | servo-controller | - |
dc.relation.journalWebOfScienceCategory | Engineering, Electrical & Electronic | - |
dc.relation.journalWebOfScienceCategory | Nanoscience & Nanotechnology | - |
dc.relation.journalWebOfScienceCategory | Instruments & Instrumentation | - |
dc.relation.journalWebOfScienceCategory | Physics, Applied | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Engineering | - |
dc.relation.journalResearchArea | Science & Technology - Other Topics | - |
dc.relation.journalResearchArea | Instruments & Instrumentation | - |
dc.relation.journalResearchArea | Physics | - |
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