DC Field | Value | Language |
---|---|---|
dc.contributor.author | Park, JS | - |
dc.contributor.author | Gianch | - |
dc.contributor.author | ani, YB | - |
dc.date.accessioned | 2016-03-31T09:34:34Z | - |
dc.date.available | 2016-03-31T09:34:34Z | - |
dc.date.created | 2011-07-19 | - |
dc.date.issued | 2000-12 | - |
dc.identifier.issn | 0960-1317 | - |
dc.identifier.other | 2000-OAK-0000023766 | - |
dc.identifier.uri | https://oasis.postech.ac.kr/handle/2014.oak/17355 | - |
dc.description.abstract | This paper describes a capacitive absolute-pressure sensor in which the sealed lead transfer is eliminated. The pick-off capacitance is between a flap or skirt-like extension of the flexible diaphragm that reaches past the sealed cavity, and an electrode patterned on the substrate directly below this extension. The sidewall of the cavity is relatively narrow and flexible. Finite-element analysis is used to explore the relevance of various dimensional parameters and to estimate the sensitivity and temperature coefficients of the device. The device is fabricated from p(++) Si on a glass substrate using the dissolved wafer process with three masking steps. The measurements of fabricated devices with 1 mm radius, 7 mum cavity height, and 8 mum wall thickness show -84 ppm kPa(-1) sensitivity at room temperature in touch-mode operation. In non-touch-mode operation the sensitivity is significantly higher. A reference device with similar dimensions shows a less than 22 ppm K-1 temperature coefficient of offset below 150 degreesC. | - |
dc.description.statementofresponsibility | X | - |
dc.language | English | - |
dc.publisher | IOP Science | - |
dc.relation.isPartOf | JOURNAL OF MICROMECHANICS AND MICROENGINEERING | - |
dc.title | A capacitive absolute-pressure sensor with external pick-off electrodes | - |
dc.type | Article | - |
dc.contributor.college | 기계공학과 | - |
dc.identifier.doi | 10.1088/0960-1317/10/4/307 | - |
dc.author.google | Park, JS | - |
dc.author.google | Gianchandani, YB | - |
dc.relation.volume | 10 | - |
dc.relation.issue | 4 | - |
dc.relation.startpage | 528 | - |
dc.relation.lastpage | 533 | - |
dc.contributor.id | 10093923 | - |
dc.relation.journal | JOURNAL OF MICROMECHANICS AND MICROENGINEERING | - |
dc.relation.index | SCI급, SCOPUS 등재논문 | - |
dc.relation.sci | SCI | - |
dc.collections.name | Journal Papers | - |
dc.type.rims | ART | - |
dc.identifier.bibliographicCitation | JOURNAL OF MICROMECHANICS AND MICROENGINEERING, v.10, no.4, pp.528 - 533 | - |
dc.identifier.wosid | 000165869500008 | - |
dc.date.tcdate | 2019-01-01 | - |
dc.citation.endPage | 533 | - |
dc.citation.number | 4 | - |
dc.citation.startPage | 528 | - |
dc.citation.title | JOURNAL OF MICROMECHANICS AND MICROENGINEERING | - |
dc.citation.volume | 10 | - |
dc.contributor.affiliatedAuthor | Park, JS | - |
dc.identifier.scopusid | 2-s2.0-0034516083 | - |
dc.description.journalClass | 1 | - |
dc.description.journalClass | 1 | - |
dc.description.wostc | 12 | - |
dc.description.scptc | 10 | * |
dc.date.scptcdate | 2018-05-121 | * |
dc.type.docType | Article | - |
dc.relation.journalWebOfScienceCategory | Engineering, Electrical & Electronic | - |
dc.relation.journalWebOfScienceCategory | Nanoscience & Nanotechnology | - |
dc.relation.journalWebOfScienceCategory | Instruments & Instrumentation | - |
dc.relation.journalWebOfScienceCategory | Physics, Applied | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Engineering | - |
dc.relation.journalResearchArea | Science & Technology - Other Topics | - |
dc.relation.journalResearchArea | Instruments & Instrumentation | - |
dc.relation.journalResearchArea | Physics | - |
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.
library@postech.ac.kr Tel: 054-279-2548
Copyrights © by 2017 Pohang University of Science ad Technology All right reserved.