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Adhesion improvement of epoxy resin/copper lead frame joints by azole compounds

Title
Adhesion improvement of epoxy resin/copper lead frame joints by azole compounds
Authors
박찬언
POSTECH Authors
박찬언
Date Issued
23-Feb-1997
URI
http://oasis.postech.ac.kr/handle/2014.oak/81792
Article Type
Conference
Citation
Gordon Conf. On the Science of Adhesion, page. 493 - 495, 1997-02-23
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박찬언PARK, CHAN EON
Dept. of Chemical Enginrg
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