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Adhesion improvement of polymer/copper lead frame

Title
Adhesion improvement of polymer/copper lead frame
Authors
박찬언
POSTECH Authors
박찬언
Date Issued
13-Oct-2000
Publisher
충남대학교
URI
http://oasis.postech.ac.kr/handle/2014.oak/76190
Article Type
Conference
Citation
한국고분자학회 추계총회, page. 7, 2000-10-13
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박찬언PARK, CHAN EON
Dept. of Chemical Enginrg
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