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Adhesion improvement of the LCP film to the Copper by plasma treatment

Title
Adhesion improvement of the LCP film to the Copper by plasma treatment
Authors
박찬언
POSTECH Authors
박찬언
Date Issued
1-Apr-2004
Publisher
한국고분자학회
URI
http://oasis.postech.ac.kr/handle/2014.oak/75103
Article Type
Conference
Citation
한국고분자학회, 2004-04-01
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박찬언PARK, CHAN EON
Dept. of Chemical Enginrg
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