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Adhesion strength of LCP/Cu joint under thermal stress

Title
Adhesion strength of LCP/Cu joint under thermal stress
Authors
박찬언
POSTECH Authors
박찬언
Date Issued
1-Oct-2004
Publisher
한국고분자학회
URI
http://oasis.postech.ac.kr/handle/2014.oak/74994
Article Type
Conference
Citation
한국고분자학회, 2004-10-01
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박찬언PARK, CHAN EON
Dept. of Chemical Enginrg
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