Low temperature pulsed MOCVD of Cu seed layer using (hfac)Cu(DMB)
- Title
- Low temperature pulsed MOCVD of Cu seed layer using (hfac)Cu(DMB)
- Authors
- 용기중
- Date Issued
- 2003-02-01
- URI
- https://oasis.postech.ac.kr/handle/2014.oak/74104
- Article Type
- Conference
- Citation
- 제10회 한국반도체 학술대회, 2003-02-01
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- There are no files associated with this item.
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