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Low temperature pulsed MOCVD of Cu seed layer using (hfac)Cu(DMB)

Title
Low temperature pulsed MOCVD of Cu seed layer using (hfac)Cu(DMB)
Authors
용기중
Date Issued
2003-02-01
URI
https://oasis.postech.ac.kr/handle/2014.oak/74104
Article Type
Conference
Citation
제10회 한국반도체 학술대회, 2003-02-01
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용기중YONG, KIJUNG
Dept. of Chemical Enginrg
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