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Adhesion Strength of LCP/Cu Joint Under Thermal Treatment

Title
Adhesion Strength of LCP/Cu Joint Under Thermal Treatment
Authors
박찬언
POSTECH Authors
박찬언
Date Issued
1-Nov-2004
Publisher
한국마이크로전자 및 패키징학회
URI
http://oasis.postech.ac.kr/handle/2014.oak/73376
Article Type
Conference
Citation
한국마이크로전자 및 패키징학회, 2004-11-01
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박찬언PARK, CHAN EON
Dept. of Chemical Enginrg
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