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Adhesion Strength of LCP/Cu Joint Under Thermal Treatment
- Title
- Adhesion Strength of LCP/Cu Joint Under Thermal Treatment
- Authors
- 박찬언
- Date Issued
- 2004-11-01
- Publisher
- 한국마이크로전자 및 패키징학회
- Article Type
- Conference
- Citation
- 한국마이크로전자 및 패키징학회, 2004-11-01
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Related Researcher
- 박찬언PARK, CHAN EON
- Dept. of Chemical Enginrg