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가역 물리적 패키징 메커니즘을 이용한 신뢰성 있는 PDMS 마이크로스텐실 제작방법

Title
가역 물리적 패키징 메커니즘을 이용한 신뢰성 있는 PDMS 마이크로스텐실 제작방법
Authors
김준원김호진원동준이상현최인호
POSTECH Authors
김준원
Date Issued
3-Apr-2014
Publisher
The 16th Korean MEMS Conference
URI
http://oasis.postech.ac.kr/handle/2014.oak/70005
Article Type
Conference
Citation
The 16th Korean MEMS Conference, 2014-04-03
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김준원KIM, JOON WON
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