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Full-speed USB 2.0 device 용 Link 및 Application layer 칩

Title
Full-speed USB 2.0 device 용 Link 및 Application layer 칩
Authors
심재윤신기범성기환김병섭박홍준
POSTECH Authors
심재윤김병섭박홍준
Date Issued
23-Nov-2013
Publisher
대한전자공학회
URI
http://oasis.postech.ac.kr/handle/2014.oak/65790
Article Type
Conference
Citation
대한전자공학회 추계학술대회, page. 43 - 46, 2013-11-23
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김병섭KIM, BYUNGSUB
Dept of Electrical Enginrg
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