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dc.contributor.author심재윤-
dc.contributor.author박홍준-
dc.contributor.author이일민-
dc.date.accessioned2018-06-18T06:22:00Z-
dc.date.available2018-06-18T06:22:00Z-
dc.date.created2013-03-07-
dc.date.issued2012-11-06-
dc.identifier.urihttps://oasis.postech.ac.kr/handle/2014.oak/62955-
dc.publisherIEEE-
dc.relation.isPartOfInternational SoC Design Conference-
dc.relation.isPartOfISOCC-
dc.titleAn On-chip TSV Emulation Using Metal Bar Surrounded by Metal Ring to Develop Interface Circuits-
dc.typeConference-
dc.type.rimsCONF-
dc.identifier.bibliographicCitationInternational SoC Design Conference, pp.192 - 195-
dc.citation.conferenceDate2012-11-04-
dc.citation.conferencePlaceKO-
dc.citation.endPage195-
dc.citation.startPage192-
dc.citation.titleInternational SoC Design Conference-
dc.contributor.affiliatedAuthor심재윤-
dc.contributor.affiliatedAuthor박홍준-
dc.contributor.affiliatedAuthor이일민-
dc.description.journalClass1-
dc.description.journalClass1-

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박홍준PARK, HONG JUNE
Dept of Electrical Enginrg
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