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Coupled CAE Analysis between Filling and Cooling Stages: Case Study for Powder Injection Molding: Electric Package

Title
Coupled CAE Analysis between Filling and Cooling Stages: Case Study for Powder Injection Molding: Electric Package
Authors
박성진
Date Issued
2000-09-20
Publisher
JSPM
URI
https://oasis.postech.ac.kr/handle/2014.oak/45234
Article Type
Conference
Citation
2000 PM World Congress, 2000-09-20
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박성진PARK, SEONG JIN
Dept of Mechanical Enginrg
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